UV胶.底部填充
UV adhesive bottom filling

适用范围极广、塑料与各种材料的粘接

It can be used in a wide range ofapplications

uv胶又称光敏胶、紫外光固化胶，是一种必须通过紫外线光照射才能固化的一类胶粘剂，应用于塑料与塑料、塑料与玻璃、塑料与金属等材料的粘接，粘接强度高，可通过自动机械点胶或网印施胶、方便操作。


Uv gum also known as photosensitive glue,UV curable adhesive,is a mustthrough a UV light irradiation to cure the adhesiveadhesive used in plasticsand plastic,plastic and glass,plastic and metal materials,high bondingstrength,through the automaticscreen printingordispensingglue,convenientoperation and.

主要针对工艺品行业塑料的自粘和互粘，家具行业，例如茶几玻璃与钢架粘接，玻璃鱼缸粘接，包括PMMA亚克力(有机玻璃)、PC、ABS、PVC、PS等热塑性塑料。玻璃制品，玻璃家具，电子秤粘接水晶珠宝工艺制品，固定镶嵌透明塑料工艺制品粘接，PMMA/PS接线柱/继电器/电容器和微开关的涂装和密封。


Uv gum also known as photosensitive glue,UV curable adhesive,is amustthrough a UVlight irradiation to cure the adhesive,adhesiveused in plasticsand plastic,plastic and glass,plastic and metal materials.high bondingstrength,through the automatic screen printing ordispensing glue,convenientoperation and.

适用于CSP/BGA的底部填充

Bottom filling for CSP/BGA

底部填充胶:用于CSP/BGA的底部填充，工艺操作性好，易维修，抗冲击，跌落，抗振性好，大大提高了电子产品的可靠性


Bottom filine elue;it is used for the bottom filing ofCSP/BGAwith good process operability,Easy to maintain,antiimpact,dr-op.anti vibration,greatlyimprove the electronic productsRelia-bility.

底部填充胶是一种低黏度、低温固化的毛细管流动底部下填料(Underfill),流动速度快，工作寿命长、翻修性能佳。广泛应用在MP3、USB、手机、篮牙等手提电子产品的线路板组装。


The underfill is a low viscosity,low temperature curing capillar-ybottomUnderfill has the advantages of high flow speed,longservice life andrenovationGood performance.Widelyused in MP3,USB,mobile phone,Bluetooth and other portableelectr-onic productsAssembly of PCB.